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Technical capacity
      Equipment

Technology Capabilities

No.

ITEM TECHNICAL DATA

1

Layers 2-24layers

2

Month Capacity 100,000Sqft

3

MAX PCB Board Size 500×1200mm (Normal 450×660mm)

4

PCB Board Thickness 0.1-8.0mm

5

Min Line Width 3mil

6

Min Line Space 3mil

7

Min Hole Size 0.1mm

8

Copper Thickness 1/3 OZ-8 OZ

9

HoleWall Cu Thickness 0.8mil

10

PTH Dia Tolerance ±2mil

11

NPTH Dia Tolerance ±1mil

12

Hole Position Tolerance ±3mil

13

Outline Tolerance ±4mil

14

SoldMask Pitch 4mil

15

Aspect Ratio 12:01

16

Impedance Control ±10%

17

Bow and Twist ≤0.7%

18

Blind and Bury Hole YES

19

Gold Finger Au Thickness Max 35μ"

20

Select Plating Gold Thickness Max 120μ"

21

ROHS Compliance YES

22

Surface Finished HAL、Lead Free HAL、Immersion Au、
Immersion Silver、Plate Au、OSP、Gold Finger and so on.

 
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