 |
| Technical capacity |
 |
|
|
|
|
Technology Capabilities |
|
No. |
ITEM |
TECHNICAL DATA |
|
1 |
Layers |
2-24layers |
|
2 |
Month Capacity |
100,000Sqft |
|
3 |
MAX PCB Board Size |
500×1200mm (Normal 450×660mm) |
|
4 |
PCB Board Thickness |
0.1-8.0mm |
|
5 |
Min Line Width |
3mil |
|
6 |
Min Line Space |
3mil |
|
7 |
Min Hole Size |
0.1mm |
|
8 |
Copper Thickness |
1/3 OZ-8 OZ |
|
9 |
HoleWall Cu Thickness |
0.8mil |
|
10 |
PTH Dia Tolerance |
±2mil |
|
11 |
NPTH Dia Tolerance |
±1mil |
|
12 |
Hole Position Tolerance |
±3mil |
|
13 |
Outline Tolerance |
±4mil |
|
14 |
SoldMask Pitch |
4mil |
|
15 |
Aspect Ratio |
12:01 |
|
16 |
Impedance Control |
±10% |
|
17 |
Bow and Twist |
≤0.7% |
|
18 |
Blind and Bury Hole |
YES |
|
19 |
Gold Finger Au Thickness |
Max 35μ" |
|
20 |
Select Plating Gold Thickness |
Max 120μ" |
|
21 |
ROHS Compliance |
YES |
|
22 |
Surface Finished |
HAL、Lead Free HAL、Immersion Au、
Immersion Silver、Plate Au、OSP、Gold Finger and so on. | |
|
